MPC8240LZU200X
vs
XPC8240RZU250E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
LBGA,
LBGA, BGA352,26X26,50
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
Length
35 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
352
352
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Seated Height-Max
1.65 mm
1.65 mm
Speed
200 MHz
250 MHz
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
5
Rohs Code
ECCN Code
3A991.A.2
Additional Feature
ALSO REQUIRES 3.3V I/O SUPPLY
Address Bus Width
32
Clock Frequency-Max
66 MHz
Package Equivalence Code
BGA352,26X26,50
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED