GX1-200B-85-1.8
vs
MCF5484CZP200
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
EBGA-352
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Pin Count
352
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
13 Weeks
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33 MHz
66.67 MHz
External Data Bus Width
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B388
JESD-609 Code
e0
e0
Length
35 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
352
388
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2.55 mm
Speed
200 MHz
200 MHz
Supply Voltage-Max
1.89 V
3.6 V
Supply Voltage-Min
1.71 V
3 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
Samacsys Manufacturer
NXP
Samacsys Modified On
2024-11-04 11:13:01
Category CO2 Kg
12.2
Compliance Temperature Grade
Industrial: -40C to +85C
EFUP
50
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.31
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare GX1-200B-85-1.8 with alternatives
Compare MCF5484CZP200 with alternatives