GX1-200B-85-1.8
vs
XPC8245LZU266LA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
BGA
Package Description
EBGA-352
BGA, BGA352,26X26,50
Pin Count
352
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Factory Lead Time
4 Weeks
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
Clock Frequency-Max
33 MHz
External Data Bus Width
32
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
JESD-609 Code
e0
Length
35 mm
Low Power Mode
YES
Number of Terminals
352
352
Operating Temperature-Max
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA352,26X26,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Speed
200 MHz
266 MHz
Supply Voltage-Max
1.89 V
Supply Voltage-Min
1.71 V
Supply Voltage-Nom
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
4
3
Power Supplies
1.8,3.3 V
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