GTL2002DC,118 vs GTL2002D,118 feature comparison

GTL2002DC,118 NXP Semiconductors

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GTL2002D,118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP SOIC
Package Description 2.30 MM WIDTH, PLASTIC, MO-187, SOT765-1, VSSOP-8 SOP-8
Pin Count 8 8
Manufacturer Package Code SOT765-1 SOT96-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature Also required VDREF 0 to 5.5V
Interface IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4 e4
Length 2.3 mm 4.9 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP SOP
Package Equivalence Code TSSOP8,.12,20 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.75 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min
Supply Voltage1-Max 5.5 V 3.6 V
Supply Voltage1-Min 3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 3.9 mm
Base Number Matches 1 1
Samacsys Manufacturer NXP
Supply Voltage1-Nom 3.3 V

Compare GTL2002DC,118 with alternatives

Compare GTL2002D,118 with alternatives