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GS8662TT37BGD-400I vs GS8662TT37BGD-350I feature comparison

GS8662TT37BGD-400I GSI Technology

Buy Now Datasheet

GS8662TT37BGD-350I GSI Technology

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 LBGA, BGA165,11X15,40
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks 24 Weeks
Category CO2 Kg 12
Compliance Temperature Grade Industrial: -40C to +85C
EU RoHS Version RoHS 2 (2015/863/EU)
Candidate List Date 2024-01-23
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V6.31
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE PIPELINED ARCHITECTURE, LATE WRITE
Clock Frequency-Max (fCLK) 400 MHz 350 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1 e1
Length 15 mm 15 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX36 2MX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.255 A 0.25 A
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.81 mA 0.765 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 2 2
Memory » SRAMs
Memory » SRAMs

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