Datasheets
GS8662TT37BGD-400I by: GSI Technology

DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS8662TT37BGD-400I by GSI Technology

Overview of GS8662TT37BGD-400I by GSI Technology

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Applications Space Technology Environmental Monitoring Internet of Things (IoT) Industrial Automation Smart Cities Agriculture Technology Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Medical Imaging Consumer Electronics Security and Surveillance Aerospace and Defense Healthcare Robotics and Drones

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Price & Stock for GS8662TT37BGD-400I

Part # Distributor Description Stock Price Buy
DISTI # GS8662TT37BGD-400I
Avnet Americas SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8662TT37BGD-400I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $130.0860
  • 288 $127.7208
  • 576 $121.4136
  • 864 $118.2600
  • 1,152 $114.3180
$114.3180 / $130.0860 Buy Now
DISTI # 464-8662TT37BGD400I
Mouser Electronics SRAM 1.8 or 1.5V 2M x 36 72M RoHS: Compliant 0
  • 15 $118.5600
  • 30 $118.2300
  • 60 $115.0600
$115.0600 / $118.5600 Order Now

Part Details for GS8662TT37BGD-400I

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GS8662TT37BGD-400I Part Data Attributes

GS8662TT37BGD-400I GSI Technology
Buy Now Datasheet
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GS8662TT37BGD-400I GSI Technology DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.255 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.81 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Alternate Parts for GS8662TT37BGD-400I

This table gives cross-reference parts and alternative options found for GS8662TT37BGD-400I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662TT37BGD-400I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8662TT37BGD-400IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662TT37BGD-400IT
GS8662TT37BD-400IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662TT37BD-400IT
GS8662TT37BD-400 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662TT37BD-400
GS8662TT37BGD-400T DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662TT37BGD-400T
Part Number Description Manufacturer Compare
CY7C2570KV18-500BZC DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662TT37BGD-400I vs CY7C2570KV18-500BZC
GS8662TT38BGD-400 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662TT38BGD-400
GS8662TT37BD-400IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662TT37BD-400IT
GS8662T36BD-350I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662T36BD-350I
GS8662TT37BD-300I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662TT37BD-300I
GS8662TT37BGD-333I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662TT37BGD-333I
GS8662QT37BGD-357IT QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662QT37BGD-357IT
GS8662QT37BD-357 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662QT37BD-357
GS8662QT37BGD-200I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662QT37BGD-200I
GS8662TT37BD-400 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662TT37BGD-400I vs GS8662TT37BD-400

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