GS8640E36T-167T
vs
CY7C1484V33-167BGC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
BGA
Package Description
LQFP,
BGA, BGA119,7X17,50
Pin Count
100
119
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
8 ns
3.4 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PBGA-B119
Length
22 mm
22 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
100
119
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX36
2MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.45 mm
2.4 mm
Supply Voltage-Max (Vsup)
2.7 V
3.465 V
Supply Voltage-Min (Vsup)
2.3 V
3.135 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
167 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Standby Voltage-Min
3.14 V
Compare GS8640E36T-167T with alternatives
Compare CY7C1484V33-167BGC with alternatives