CY7C1484V33-167BGC
vs
K7N641845M-QC160
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
QFP
Package Description
BGA, BGA119,7X17,50
LQFP, QFP100,.63X.87
Pin Count
119
100
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.4 ns
3.5 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
167 MHz
166 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B119
R-PQFP-G100
Length
22 mm
20 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
36
18
Number of Functions
1
1
Number of Terminals
119
100
Number of Words
2097152 words
4194304 words
Number of Words Code
2000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX36
4MX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LQFP
Package Equivalence Code
BGA119,7X17,50
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
1.6 mm
Standby Voltage-Min
3.14 V
2.38 V
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
14 mm
14 mm
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare CY7C1484V33-167BGC with alternatives
Compare K7N641845M-QC160 with alternatives