GS8640E36GT-250IV
vs
GS8642ZV36F-300T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
QFP
BGA
Package Description
LQFP,
BGA,
Pin Count
100
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
6.5 ns
5.5 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PBGA-B165
JESD-609 Code
e3
Length
20 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
100
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
2 V
2 V
Supply Voltage-Min (Vsup)
1.7 V
1.6 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
Terminal Position
QUAD
BOTTOM
Width
14 mm
Base Number Matches
1
1
Compare GS8640E36GT-250IV with alternatives
Compare GS8642ZV36F-300T with alternatives