GS4288C36GL-18 vs MT49H8M36CBM-25 feature comparison

GS4288C36GL-18 GSI Technology

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MT49H8M36CBM-25 Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TBGA, LEAD FREE, MICRO, BGA-144
Pin Count 144 144
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B EAR99
HTS Code 8542.32.00 8542.32.00.28
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO REFRESH AUTO REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e1 e1
Memory Density 301989888 bit 301989888 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 8MX36 8MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.2 mm 0.93 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 11 mm 11 mm
Base Number Matches 4 2
Pbfree Code Yes
Access Time-Max 0.25 ns
Length 18.5 mm
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL

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