GM76C256BLLFW-55 vs CY62256-55SNC feature comparison

GM76C256BLLFW-55 LG Semicon Co Ltd

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CY62256-55SNC Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code unknown not_compliant
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP28,.5 SOP28,.5
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.00001 A 0.005 A
Standby Voltage-Min 2 V 4.5 V
Supply Current-Max 0.07 mA 0.055 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code SOIC
Package Description 0.300 INCH, SOIC-28
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.41
Length 18.39 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Seated Height-Max 2.794 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm

Compare GM76C256BLLFW-55 with alternatives

Compare CY62256-55SNC with alternatives