GM23C8000AFW-15 vs HN62338BTT-10 feature comparison

GM23C8000AFW-15 LG Semicon Co Ltd

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HN62338BTT-10 Hitachi Ltd

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LG SEMICON CO LTD HITACHI LTD
Reach Compliance Code unknown unknown
Access Time-Max 150 ns 100 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0
Memory Density 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX8 1MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP2
Package Equivalence Code SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.00005 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code TSOP2
Package Description TSOP2,
Pin Count 32
ECCN Code EAR99
HTS Code 8542.32.00.71
Length 20.95 mm
Seated Height-Max 1.2 mm
Width 10.16 mm

Compare GM23C8000AFW-15 with alternatives

Compare HN62338BTT-10 with alternatives