GD80960JT-100
vs
GD80960JT100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-196
BGA, BGA196(UNSPEC)
Pin Count
196
196
Reach Compliance Code
compliant
compliant
Additional Feature
BURST BUS
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33.3 MHz
33.3 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
1
Number of Terminals
196
196
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA196(UNSPEC)
BGA196(UNSPEC)
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
Power Supplies
3.3,3.3/5 V
Qualification Status
Not Qualified
Not Qualified
Speed
100 MHz
100 MHz
Supply Current-Max
600 mA
600 mA
Supply Voltage-Max
3.45 V
3.45 V
Supply Voltage-Min
3.15 V
3.15 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Compare GD80960JT-100 with alternatives
Compare GD80960JT100 with alternatives