GD54HC85J vs GD74HC85 feature comparison

GD54HC85J LG Semicon Co Ltd

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GD74HC85 Goldstar Electron Co Ltd

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD GOLDSTAR ELECTRON CO LTD
Package Description DIP, DIP16,.3 ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
JESD-30 Code R-XDIP-T16 R-PDIP-T16
JESD-609 Code e0
Logic IC Type MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Additional Feature CASCADABLE
Family HC/UH
Load Capacitance (CL) 50 pF
Number of Bits 4
Number of Functions 1
Output Polarity TRUE
Propagation Delay (tpd) 49 ns
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V

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