GAL22V10B-25LP
vs
GAL22V10D-25LD/883
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
PLASTIC, DIP-24
CERDIP-24
Pin Count
24
24
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
REGISTER PRELOAD; POWER-UP RESET
Architecture
PAL-TYPE
PAL-TYPE
Clock Frequency-Max
33.3 MHz
25 MHz
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
31.877 mm
31.75 mm
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Inputs
22
22
Number of Outputs
10
10
Number of Product Terms
132
132
Number of Terminals
24
24
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.953 mm
5.08 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
ECCN Code
3A001.A.2.C
Moisture Sensitivity Level
1
Screening Level
38535Q/M;38534H;883B
Compare GAL22V10B-25LP with alternatives
Compare GAL22V10D-25LD/883 with alternatives