GAL22V10B-25LP
vs
5962-8984104LX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
PLASTIC, DIP-24
DIP,
Pin Count
24
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
REGISTER PRELOAD; POWER-UP RESET
Architecture
PAL-TYPE
Clock Frequency-Max
33.3 MHz
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
JESD-609 Code
e0
Length
31.877 mm
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Number of Terminals
24
24
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
FLASH PLD
Propagation Delay
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.953 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
8
ECCN Code
3A001.A.2.C
Compare GAL22V10B-25LP with alternatives
Compare 5962-8984104LX with alternatives