GAL20RA10-20LDM
vs
PAL16R6-10LMB
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Package Description |
DIP, DIP24,.3
|
QCCN, LCC20,.35SQ
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Architecture |
PAL-TYPE
|
PAL-TYPE
|
Clock Frequency-Max |
33.3 MHz
|
87 MHz
|
JESD-30 Code |
R-XDIP-T24
|
S-CQCC-N20
|
JESD-609 Code |
e0
|
e0
|
Number of Inputs |
20
|
10
|
Number of Outputs |
10
|
6
|
Number of Product Terms |
80
|
64
|
Number of Terminals |
24
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Function |
REGISTERED
|
MIXED
|
Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
QCCN
|
Package Equivalence Code |
DIP24,.3
|
LCC20,.35SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Programmable Logic Type |
EE PLD
|
OT PLD
|
Propagation Delay |
20 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
QLCC
|
Pin Count |
|
20
|
Additional Feature |
|
POWER-UP RESET
|
Length |
|
8.89 mm
|
Number of Dedicated Inputs |
|
8
|
Number of I/O Lines |
|
2
|
Organization |
|
8 DEDICATED INPUTS, 2 I/O
|
Screening Level |
|
38535Q/M;38534H;883B
|
Seated Height-Max |
|
1.905 mm
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
Width |
|
8.89 mm
|
|
|
|
Compare GAL20RA10-20LDM with alternatives
Compare PAL16R6-10LMB with alternatives