PAL16R6-10LMB
vs
TIBPAL16R4-10MJ
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QLCC
|
|
Package Description |
QCCN, LCC20,.35SQ
|
DIP,
|
Pin Count |
20
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
POWER-UP RESET
|
POWER-UP RESET; REGISTER PRELOAD
|
Architecture |
PAL-TYPE
|
|
Clock Frequency-Max |
87 MHz
|
52.5 MHz
|
JESD-30 Code |
S-CQCC-N20
|
R-GDIP-T20
|
JESD-609 Code |
e0
|
e0
|
Length |
8.89 mm
|
24.195 mm
|
Number of Dedicated Inputs |
8
|
8
|
Number of I/O Lines |
2
|
4
|
Number of Inputs |
10
|
|
Number of Outputs |
6
|
|
Number of Product Terms |
64
|
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
8 DEDICATED INPUTS, 2 I/O
|
8 DEDICATED INPUTS, 4 I/O
|
Output Function |
MIXED
|
MIXED
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCN
|
DIP
|
Package Equivalence Code |
LCC20,.35SQ
|
DIP20,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Programmable Logic Type |
OT PLD
|
OT PLD
|
Propagation Delay |
10 ns
|
12 ns
|
Qualification Status |
Not Qualified
|
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
1.905 mm
|
5.08 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
BICMOS
|
TTL
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
8.89 mm
|
7.62 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare PAL16R6-10LMB with alternatives
Compare TIBPAL16R4-10MJ with alternatives