FX-700-LAF-GNK-D5-J6
vs
SY88307BLMGTR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICREL INC
Package Description
SMD-16
HVQCCN, LCC16,.12SQ,20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-CQCC-N16
S-XQCC-N16
JESD-609 Code
e4
e4
Length
7.49 mm
3 mm
Moisture Sensitivity Level
1
2
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
QCCN
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Seated Height-Max
2.13 mm
0.95 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
ATM/SONET/SDH SUPPORT CIRCUIT
ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
GOLD OVER NICKEL
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.02 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
15
40
Width
5.08 mm
3 mm
Base Number Matches
3
2
Pbfree Code
Rohs Code
Part Package Code
DFN
Pin Count
16
Manufacturer Package Code
MLF
Applications
SDH; SONET
Package Equivalence Code
LCC16,.12SQ,20
Qualification Status
Not Qualified
Supply Current-Max
0.06 mA
Compare SY88307BLMGTR with alternatives