FX-700-LAF-GNK-D5-J6
vs
M02049-XX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MINDSPEED TECHNOLOGIES INC
|
| Package Description |
QCCN,
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Applications |
ATM; SDH; SONET
|
|
| JESD-30 Code |
R-CQCC-N16
|
S-XQCC-N16
|
| JESD-609 Code |
e4
|
|
| Length |
7.49 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
| Package Code |
QCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC16,.2X.3,40
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Seated Height-Max |
2.13 mm
|
0.9 mm
|
| Supply Current-Max |
40 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
GOLD OVER NICKEL
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.02 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
15
|
NOT SPECIFIED
|
| Width |
5.08 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
16
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare FX-700-LAF-GNK-D5-J6 with alternatives
Compare M02049-XX with alternatives