FTS88130-25C4M
vs
FTS88130L-25LMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
FORCE TECHNOLOGIES LTD
FORCE TECHNOLOGIES LTD
Part Package Code
DIP
QFJ
Package Description
DIP,
QCCN,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-CDIP-T32
R-PQCC-N32
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B (Modified)
MIL-STD-883
Seated Height-Max
5.89 mm
1.9 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Base Number Matches
1
1
Length
11.43 mm
Supply Current-Max
0.14 mA
Width
11.43 mm
Compare FTS88130-25C4M with alternatives
Compare FTS88130L-25LMB with alternatives