FTS88130L-25LMB
vs
FTS88130L-25C4MB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
FORCE TECHNOLOGIES LTD
FORCE TECHNOLOGIES LTD
Part Package Code
QFJ
DIP
Package Description
QCCN,
DIP,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-PQCC-N32
R-CDIP-T32
Length
11.43 mm
43.18 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
1.9 mm
5.89 mm
Supply Current-Max
0.14 mA
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
11.43 mm
10.16 mm
Base Number Matches
1
1
Compare FTS88130L-25LMB with alternatives
Compare FTS88130L-25C4MB with alternatives