EPM570GF256C5 vs EPM570GF256A3 feature comparison

EPM570GF256C5 Intel Corporation

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EPM570GF256A3 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 17 X 17 MM, 1 MM PITCH, FBGA-256
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Additional Feature YES YES
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 1
Number of Dedicated Inputs
Number of I/O Lines 160 160
Number of Inputs 160 160
Number of Macro Cells 440 440
Number of Outputs 160 160
Number of Terminals 256 256
Operating Temperature-Max 85 °C 124 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 160 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 8.7 ns 5.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 2 2

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