EPF10K30RC208-4
vs
EPF10K30AFC256-2N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
RQFP-208
FINE LINE, BGA-256
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
1728 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
1728 LOGIC ELEMENTS; 216 LABS
Clock Frequency-Max
62.89 MHz
80 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
JESD-609 Code
e0
e1
Length
28 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
147
191
Number of Inputs
147
191
Number of Logic Cells
1728
1728
Number of Outputs
147
191
Number of Terminals
208
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 147 I/O
4 DEDICATED INPUTS, 191 I/O
Output Function
REGISTERED
REGISTERED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HFQFP
BGA
Package Equivalence Code
HQFP208,1.2SQ,20
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, HEAT SINK/SLUG, FINE PITCH
GRID ARRAY
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.6 ns
0.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
2.1 mm
Supply Voltage-Max
5.25 V
3.6 V
Supply Voltage-Min
4.75 V
3 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
17 mm
Base Number Matches
2
1
Pbfree Code
Part Package Code
BGA
Pin Count
256
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare EPF10K30RC208-4 with alternatives
Compare EPF10K30AFC256-2N with alternatives