EPF10K30AFC256-2N
vs
EPF10K30RI208-4N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
FINE LINE, BGA-256
RQFP-208
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
1728 LOGIC ELEMENTS; 216 LABS
1728 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max
80 MHz
62.89 MHz
JESD-30 Code
S-PBGA-B256
S-PQFP-G208
JESD-609 Code
e1
e3
Length
17 mm
28 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
191
147
Number of Inputs
191
147
Number of Logic Cells
1728
1728
Number of Outputs
191
147
Number of Terminals
256
208
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4 DEDICATED INPUTS, 191 I/O
4 DEDICATED INPUTS, 147 I/O
Output Function
REGISTERED
REGISTERED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HFQFP
Package Equivalence Code
BGA256,16X16,40
HQFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, HEAT SINK/SLUG, FINE PITCH
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.7 ns
0.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
4.1 mm
Supply Voltage-Max
3.6 V
5.25 V
Supply Voltage-Min
3 V
4.75 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
17 mm
28 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
QFP
Pin Count
208
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
30
Compare EPF10K30AFC256-2N with alternatives
Compare EPF10K30RI208-4N with alternatives