EPF10K100EFI256-2N
vs
EPF10K100EQI240-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA,
FQFP, QFP240,1.3SQ,20
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
JESD-30 Code
S-PBGA-B256
S-PQFP-G240
JESD-609 Code
e1
e0
Length
17 mm
32 mm
Number of I/O Lines
191
189
Number of Terminals
256
240
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
191 I/O
189 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FQFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, FINE PITCH
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.5 ns
9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
4.1 mm
Supply Voltage-Max
2.625 V
2.7 V
Supply Voltage-Min
2.375 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
17 mm
32 mm
Base Number Matches
1
3
Pbfree Code
Part Package Code
QFP
Pin Count
240
Moisture Sensitivity Level
3
Number of Inputs
189
Number of Logic Cells
4992
Number of Outputs
189
Package Equivalence Code
QFP240,1.3SQ,20
Peak Reflow Temperature (Cel)
220
Compare EPF10K100EFI256-2N with alternatives
Compare EPF10K100EQI240-1 with alternatives