EPF10K100EFI256-2N
vs
EPF10K100EQC208-3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA,
30.60 X 30.60 MM, 0.50 MM PITCH, PLASTIC, QFP-208
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
JESD-30 Code
S-PBGA-B256
S-PQFP-G208
JESD-609 Code
e1
e0
Length
17 mm
28 mm
Number of I/O Lines
191
147
Number of Terminals
256
208
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
191 I/O
147 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FQFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, FINE PITCH
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.5 ns
0.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
4.1 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
17 mm
28 mm
Base Number Matches
1
4
Pbfree Code
Part Package Code
QFP
Pin Count
208
Additional Feature
4992 LOGIC ELEMENTS
Clock Frequency-Max
140 MHz
Moisture Sensitivity Level
3
Number of Inputs
147
Number of Logic Cells
4992
Number of Outputs
147
Package Equivalence Code
QFP208,1.2SQ,20
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
20
Compare EPF10K100EFI256-2N with alternatives
Compare EPF10K100EQC208-3 with alternatives