EPF10K100EFC256-1
vs
EPF10K100EQI240-2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ALTERA CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
QFP
Package Description
17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
FQFP,
Pin Count
256
240
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-PQFP-G240
JESD-609 Code
e0
e0
Length
17 mm
32 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
191
189
Number of Inputs
191
Number of Logic Cells
4992
Number of Outputs
191
Number of Terminals
256
240
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
191 I/O
189 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FQFP
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel)
220
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.4 ns
0.5 ns
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
2.1 mm
4.1 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
20
30
Width
17 mm
32 mm
Base Number Matches
2
2
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