EPF10K100EFC256-1
vs
EPF10K100BFI256-2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
BGA, BGA256,16X16,40
Pin Count
256
256
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
191
191
Number of Inputs
191
191
Number of Logic Cells
4992
4992
Number of Outputs
191
191
Number of Terminals
256
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
191 I/O
191 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.4 ns
12 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.1 mm
Supply Voltage-Max
2.625 V
2.7 V
Supply Voltage-Min
2.375 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
17 mm
17 mm
Base Number Matches
2
1
Compare EPF10K100EFC256-1 with alternatives
Compare EPF10K100BFI256-2 with alternatives