EP9312-IB
vs
MPC8245ARZU466D
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
CIRRUS LOGIC INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
27 X 27 MM, PLASTIC, BGA-352
|
LBGA, BGA352,26X26,50
|
| Pin Count |
352
|
352
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
26
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
14.7456 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
| JESD-609 Code |
e0
|
|
| Length |
27 mm
|
35 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
352
|
352
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LBGA
|
| Package Equivalence Code |
BGA352,20X20,50
|
BGA352,26X26,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.5 mm
|
1.65 mm
|
| Speed |
184 MHz
|
466 MHz
|
| Supply Voltage-Max |
1.94 V
|
2.2 V
|
| Supply Voltage-Min |
1.65 V
|
2 V
|
| Supply Voltage-Nom |
1.8 V
|
2.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
2
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
220
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare EP9312-IB with alternatives
Compare MPC8245ARZU466D with alternatives