EP9312-IB
vs
XPC8245TZU350B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CIRRUS LOGIC INC
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, PLASTIC, BGA-352
LBGA, BGA352,26X26,50
Pin Count
352
352
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
26
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
14.7456 MHz
66 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
JESD-609 Code
e0
e0
Length
27 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
352
352
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA352,20X20,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.5 mm
1.65 mm
Speed
184 MHz
350 MHz
Supply Voltage-Max
1.94 V
2.1 V
Supply Voltage-Min
1.65 V
1.9 V
Supply Voltage-Nom
1.8 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
4
ECCN Code
3A991.A.2
Compare EP9312-IB with alternatives
Compare XPC8245TZU350B with alternatives