MPC8245ARZU466D
vs
PC8240VTPU200C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
TELEDYNE E2V (UK) LTD
Package Description
LBGA, BGA352,26X26,50
LBGA,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
Length
35 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
352
352
Operating Temperature-Max
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
1.65 mm
Speed
466 MHz
200 MHz
Supply Voltage-Max
2.2 V
2.625 V
Supply Voltage-Min
2 V
2.375 V
Supply Voltage-Nom
2.1 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
4
2
Part Package Code
BGA
Pin Count
352
ECCN Code
3A991.A.2
Address Bus Width
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
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