EP4SGX230HF35C3 vs EP4SGX230FF35C3ES feature comparison

EP4SGX230HF35C3 Altera Corporation

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EP4SGX230FF35C3ES Intel Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description FBGA-1152 35 X 35 MM, FBGA-1152
Pin Count 1152
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B1152 S-PBGA-B
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 3
Number of CLBs 91200 9120
Number of Inputs 564
Number of Logic Cells 228000
Number of Outputs 564
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 91200 CLBS 9120 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.6 mm 3.6 mm
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 35 mm 35 mm
Base Number Matches 2 2
Clock Frequency-Max 717 MHz
Supply Voltage-Max 0.93 V
Supply Voltage-Min 0.87 V
Supply Voltage-Nom 0.9 V

Compare EP4SGX230HF35C3 with alternatives

Compare EP4SGX230FF35C3ES with alternatives