Findchips: Compare EP4SGX230HF35C3 vs EP4SGX230FF35C3ES

EP4SGX230HF35C3 vs EP4SGX230FF35C3ES feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	ALTERA CORP	INTEL CORP
Part Package Code	BGA
Package Description	FBGA-1152	35 X 35 MM, FBGA-1152
Pin Count	1152
Reach Compliance Code	not_compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PBGA-B1152	S-PBGA-B
JESD-609 Code	e0	e0
Length	35 mm	35 mm
Moisture Sensitivity Level	4	3
Number of CLBs	91200	9120
Number of Inputs	564
Number of Logic Cells	228000
Number of Outputs	564
Number of Terminals	1152	1152
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	91200 CLBS	9120 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1152,34X34,40	BGA1152,34X34,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	220
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.6 mm	3.6 mm
Surface Mount	YES	YES
Technology	CMOS
Temperature Grade	OTHER	OTHER
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	20
Width	35 mm	35 mm
Base Number Matches	2	2
Clock Frequency-Max		717 MHz
Supply Voltage-Max		0.93 V
Supply Voltage-Min		0.87 V
Supply Voltage-Nom		0.9 V
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays