EP4SGX230HF35C3
vs
EP4SGX230HF35C4N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
FBGA-1152
LEAD FREE, FBGA-1152
Pin Count
1152
1152
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
4
4
Number of CLBs
91200
91200
Number of Inputs
564
564
Number of Logic Cells
228000
228000
Number of Outputs
564
564
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
91200 CLBS
91200 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.6 mm
3.6 mm
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
35 mm
35 mm
Base Number Matches
2
2
Compare EP4SGX230HF35C3 with alternatives
Compare EP4SGX230HF35C4N with alternatives