EP4SGX230FF35C3ES
vs
EP4SGX230FF35I3N
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
35 X 35 MM, FBGA-1152
35 X 35 MM, LEAD FREE, FBGA-1152
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
717 MHz
717 MHz
JESD-30 Code
S-PBGA-B
S-PBGA-B1152
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
9120
9120
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
9120 CLBS
9120 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.6 mm
3.6 mm
Supply Voltage-Max
0.93 V
0.93 V
Supply Voltage-Min
0.87 V
0.87 V
Supply Voltage-Nom
0.9 V
0.9 V
Surface Mount
YES
YES
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
Base Number Matches
2
2
Pbfree Code
Yes
Part Package Code
BGA
Pin Count
1152
Number of Inputs
564
Number of Logic Cells
228000
Number of Outputs
564
Peak Reflow Temperature (Cel)
245
Technology
CMOS
Time@Peak Reflow Temperature-Max (s)
30
Compare EP4SGX230FF35C3ES with alternatives
Compare EP4SGX230FF35I3N with alternatives