EP2S30F672I4
vs
EP2S30F672C3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
35 X 35 MM, 1 MM PITCH, FBGA-672
35 X 35 MM, 1 MM PITCH, FBGA-672
Pin Count
672
672
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
717 MHz
717 MHz
Combinatorial Delay of a CLB-Max
5.117 ns
4.45 ns
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13552
13552
Number of Inputs
500
500
Number of Logic Cells
33880
33880
Number of Outputs
492
492
Number of Terminals
672
672
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
13552 CLBS
13552 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA672,26X26,40
BGA672,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
20
Width
35 mm
35 mm
Base Number Matches
2
2
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Compare EP2S30F672C3 with alternatives