EP2S30F672C3
vs
EP2S30F672I4N
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
35 X 35 MM, 1 MM PITCH, FBGA-672
27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-672
Pin Count
672
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
717 MHz
717 MHz
Combinatorial Delay of a CLB-Max
4.45 ns
5.117 ns
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e0
e1
Length
35 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13552
1694
Number of Inputs
500
500
Number of Logic Cells
33880
33880
Number of Outputs
492
492
Number of Terminals
672
672
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
13552 CLBS
1694 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA672,26X26,40
BGA672,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
3.5 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
35 mm
27 mm
Base Number Matches
2
2
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Intel
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