EP2C35F484I7N vs EP2C35F484C7ES feature comparison

EP2C35F484I7N Intel Corporation

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EP2C35F484C7ES Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description LEAD FREE, FBGA-484 FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO REQUIRES 3.3 SUPPLY
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 23 mm 23 mm
Number of CLBs 2100 2100
Number of Inputs 322
Number of Logic Cells 33216
Number of Outputs 306
Number of Terminals 484 484
Organization 2100 CLBS 2100 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 23 mm 23 mm
Base Number Matches 2 2
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

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