EP2C35F484C7ES
vs
EP2C35F484C6N
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
FBGA-484
LEAD FREE, FBGA-484
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
e1
Length
23 mm
23 mm
Number of CLBs
2100
2076
Number of Terminals
484
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
2100 CLBS
2076 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
Base Number Matches
2
2
Pbfree Code
Yes
Part Package Code
BGA
Pin Count
484
Additional Feature
ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max
500 MHz
Moisture Sensitivity Level
3
Number of Inputs
322
Number of Logic Cells
33216
Number of Outputs
306
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare EP2C35F484C7ES with alternatives
Compare EP2C35F484C6N with alternatives