EP1S10F780I7ES
vs
EP1S10F780C7
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
29 X 29 MM, 1 MM PITCH, FBGA-780
29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B780
S-PBGA-B780
JESD-609 Code
e0
e0
Length
29 mm
29 mm
Number of CLBs
1057
1200
Number of Inputs
426
426
Number of Logic Cells
10570
10570
Number of Outputs
426
426
Number of Terminals
780
780
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1057 CLBS
1200 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA780,28X28,40
BGA780,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
Base Number Matches
1
3
Pbfree Code
No
Part Package Code
BGA
Pin Count
780
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
220
Seated Height-Max
3.5 mm
Temperature Grade
COMMERCIAL EXTENDED
Time@Peak Reflow Temperature-Max (s)
20
Compare EP1S10F780I7ES with alternatives
Compare EP1S10F780C7 with alternatives