EP1S10F780I7ES vs EP1S10F780C7 feature comparison

EP1S10F780I7ES Intel Corporation

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EP1S10F780C7 Altera Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 29 X 29 MM, 1 MM PITCH, FBGA-780 29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e0
Length 29 mm 29 mm
Number of CLBs 1057 1200
Number of Inputs 426 426
Number of Logic Cells 10570 10570
Number of Outputs 426 426
Number of Terminals 780 780
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1057 CLBS 1200 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 1 3
Pbfree Code No
Part Package Code BGA
Pin Count 780
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220
Seated Height-Max 3.5 mm
Temperature Grade COMMERCIAL EXTENDED
Time@Peak Reflow Temperature-Max (s) 20

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