EL7457CSZ-T13
vs
EL7457CL-T7
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
QFN, QSOP, SOIC
|
QFN
|
Package Description |
0.150 INCH, LEAD FREE, SO-16
|
4 X 4 MM, MO-220, QFN-16
|
Pin Count |
16, 16, 16
|
16
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
26 Weeks
|
|
Driver Number of Bits |
4
|
4
|
High Side Driver |
YES
|
YES
|
Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
JESD-30 Code |
R-PDSO-G16
|
S-XQCC-N16
|
JESD-609 Code |
e3
|
e0
|
Length |
9.9 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
4
|
4
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
0.1 A
|
0.1 A
|
Output Peak Current Limit-Nom |
2 A
|
2 A
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
HVQCCN
|
Package Equivalence Code |
SOP16,.25
|
LCC16,.16SQ,25
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Supply Voltage1-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
4 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare EL7457CSZ-T13 with alternatives
Compare EL7457CL-T7 with alternatives