EK23C4000K-15 vs KM23C4100H-15 feature comparison

EK23C4000K-15 Eureka Microelectronics Inc

Buy Now Datasheet

KM23C4100H-15 Samsung Semiconductor

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer EUREKA MICROELECTRONICS INC SAMSUNG SEMICONDUCTOR INC
Package Description , DIP, DIP40,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 150 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Memory Density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 256K16 256K16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.05 mA 0.06 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 40
JESD-609 Code e0
Length 52.43 mm
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE
Package Equivalence Code DIP40,.6
Seated Height-Max 5.08 mm
Standby Current-Max 0.00005 A
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare EK23C4000K-15 with alternatives

Compare KM23C4100H-15 with alternatives