EDI88130CS17L32I vs WMS512K8V-20CM feature comparison

EDI88130CS17L32I Microsemi Corporation

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WMS512K8V-20CM Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code QFJ DIP
Package Description LCC-32 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.B 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 17 ns 20 ns
I/O Type COMMON
JESD-30 Code R-CQCC-N32 R-CDIP-T32
Length 13.97 mm 42.8 mm
Memory Density 1048576 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 524288 words
Number of Words Code 128000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 128KX8 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN DIP
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.048 mm 5.13 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.5 mm
Terminal Position QUAD DUAL
Width 11.43 mm 15.24 mm
Base Number Matches 1 2
Additional Feature LG-MAX
JESD-609 Code e4
Terminal Finish GOLD

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