DSPIC33FJ128GP706A-H/MR
vs
DSPIC33FJ128GP706ATI/MR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
QFN
QFN
Package Description
9 X 9 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFN-64
HVQCCN, LCC64,.35SQ,20
Pin Count
64
64
Reach Compliance Code
compliant
compliant
Samacsys Manufacturer
Microchip
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQCC-N64
S-PQCC-N64
JESD-609 Code
e3
e3
Length
9 mm
9 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
3
Number of Terminals
64
64
Operating Temperature-Max
150 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100; TS 16949
TS 16949
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
9 mm
9 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Pbfree Code
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Format
FIXED POINT
Package Equivalence Code
LCC64,.35SQ,20
Supply Current-Max
90 mA
Compare DSPIC33FJ128GP706A-H/MR with alternatives
Compare DSPIC33FJ128GP706ATI/MR with alternatives