DSPIC33FJ128GP706ATI/MR
vs
DSPIC33FJ128GP708AE/PT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
QFN
QFP
Package Description
HVQCCN, LCC64,.35SQ,20
12 X 12 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-80
Pin Count
64
80
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQCC-N64
S-PQFP-G80
JESD-609 Code
e3
e3
Length
9 mm
12 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
1
Number of Terminals
64
80
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TQFP
Package Equivalence Code
LCC64,.35SQ,20
TQFP80,.55SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
AEC-Q100; TS 16949
Seated Height-Max
1 mm
1.2 mm
Supply Current-Max
90 mA
90 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
9 mm
12 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Compare DSPIC33FJ128GP706ATI/MR with alternatives
Compare DSPIC33FJ128GP708AE/PT with alternatives