DSPIC33CK256MP710-E/PT vs DSPIC33CK256MP710T-I/PT feature comparison

DSPIC33CK256MP710-E/PT Microchip Technology Inc

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DSPIC33CK256MP710T-I/PT Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description TQFP-100 TQFP-100
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 6 Weeks 6 Weeks
Address Bus Width
Barrel Shifter YES YES
Bit Size 16 16
Boundary Scan YES YES
Clock Frequency-Max 64 MHz 64 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQFP-G100 S-PQFP-G100
JESD-609 Code e3 e3
Length 12 mm 12 mm
Low Power Mode YES YES
Number of DMA Channels 8 8
Number of External Interrupts 4 4
Number of Serial I/Os 3 3
Number of Terminals 100 100
Number of Timers 2 2
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFQFP TFQFP
Package Equivalence Code QFP100,.55SQ,16 QFP100,.55SQ,16
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH
RAM (words) 131072 131072
ROM Programmability FLASH FLASH
Screening Level AEC-Q100; ISO 26262 ISO 26262
Seated Height-Max 1.2 mm 1.2 mm
Supply Current-Max 42.5 mA 35 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.4 mm 0.4 mm
Terminal Position QUAD QUAD
Width 12 mm 12 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1

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