DSPIC33CK256MP710-E/PT
vs
DSPIC33CK256MP202E/2N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TQFP-100
HQCCN, LCC28,.24SQ,25
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
6 Weeks
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
64 MHz
64 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
NO
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQFP-G100
S-PQCC-N28
JESD-609 Code
e3
e3
Length
12 mm
6 mm
Low Power Mode
YES
YES
Number of DMA Channels
8
4
Number of External Interrupts
4
4
Number of Serial I/Os
3
4
Number of Terminals
100
28
Number of Timers
2
2
On Chip Data RAM Width
8
8
On Chip Program ROM Width
8
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFQFP
HVQCCN
Package Equivalence Code
QFP100,.55SQ,16
LCC28,.24SQ,25
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
RAM (words)
131072
24576
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100; ISO 26262
AEC-Q100
Seated Height-Max
1.2 mm
0.55 mm
Supply Current-Max
42.5 mA
42.5 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.4 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
12 mm
6 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Rohs Code
Date Of Intro
2018-07-30
Temperature Grade
INDUSTRIAL
Compare DSPIC33CK256MP710-E/PT with alternatives
Compare DSPIC33CK256MP202E/2N with alternatives