DSPIC30F2011CT-30ESO-ES
vs
DSPIC30F2011CT-30E/MM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
QFN
Package Description
0.300 INCH, PLASTIC, MS-013, SOIC-18
6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28
Pin Count
18
28
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
NO
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
R-PDSO-G18
S-PQCC-N28
JESD-609 Code
e3
Length
11.53 mm
6 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Terminals
18
28
On Chip Program ROM Width
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
TS 16949
Seated Height-Max
2.64 mm
1 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.5 V
3 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
QUAD
Width
7.49 mm
6 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
kg CO2e/kg
12
Average Weight (mg)
61.225
CO2e (mg)
734.7
Category CO2 Kg
11.6
Compliance Temperature Grade
Automotive: -40C to +125C
Candidate List Date
2018-01-15
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.22
Compare DSPIC30F2011CT-30ESO-ES with alternatives
Compare DSPIC30F2011CT-30E/MM with alternatives