DSPIC30F2011CT-30ESO-ES
vs
DSPIC30F2011CT-30E/SO
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
SOIC
Package Description
0.300 INCH, PLASTIC, MS-013, SOIC-18
7.50 MM, PLASTIC, SOIC-18
Pin Count
18
18
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
NO
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
R-PDSO-G18
R-PDSO-G18
JESD-609 Code
e3
Length
11.53 mm
11.55 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Terminals
18
18
On Chip Program ROM Width
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
TS 16949
Seated Height-Max
2.64 mm
2.65 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.5 V
3 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.49 mm
7.5 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Compare DSPIC30F2011CT-30ESO-ES with alternatives
Compare DSPIC30F2011CT-30E/SO with alternatives