DSPIC30F2011CT-30E/MM
vs
DSPIC30F2011AT-30ESO-ES
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
QFN
SOIC
Package Description
6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28
0.300 INCH, PLASTIC, MS-013, SOIC-18
Pin Count
28
18
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
NO
YES
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQCC-N28
R-PDSO-G18
Length
6 mm
11.53 mm
Low Power Mode
YES
YES
Number of Terminals
28
18
On Chip Program ROM Width
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
TS 16949
Seated Height-Max
1 mm
2.64 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
3 V
2.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
QUAD
DUAL
Width
6 mm
7.49 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e3
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Terminal Finish
Matte Tin (Sn)
Compare DSPIC30F2011CT-30E/MM with alternatives
Compare DSPIC30F2011AT-30ESO-ES with alternatives